Concepedia

Through-wafer Etching

Through-Wafer Etching is a micromachining process in which an etchant is used to create entirely perforating structures by selectively removing material completely through the thickness of a silicon wafer, thereby enabling electrical or fluidic interconnectivity between its opposing surfaces.

108

Publications

3.2K

Citations

493

Authors

132

Institutions

Publications per year

2017–2026

7

Parents

Publications

108

Modeling, Fabrication, and Characterization of Piezoelectric Micromachined Ultrasonic Transducer Arrays Based on Cavity SOI Wafers

Yipeng Lu, David A. Horsley · Journal of Microelectromechanical Systems · 2015 · 189 citations

, , +16

3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

Michael J. Topper, Ivan Ndip, Robert Erxleben et al. · 2010 · 146 citations

, , +16

Sacrificial etching of III - V compounds for micromechanical devices

Klas Hjort · Journal of Micromechanics and Microengineering · 1996 · 102 citations

, , +16

Nanostructure patterns written in III–V semiconductors by an atomic force microscope

R. Magno, B. R. Bennett · Applied Physics Letters · 1997 · 100 citations

, , +17

Localized laser etching of compound semiconductors in aqueous solution

Richard M. Osgood, Antonio Sanchez‐Rubio, D. J. Ehrlich et al. · Applied Physics Letters · 1982 · 99 citations

, , +17

1–5 of 108

Authors

493

  1. WT
    W. T. Pike

    Imperial College London, United Kingdom

    5 publications · 117 citations

    5

    h-index

  2. SJ
    S. J. Pearton

    University of Florida, United States

    5 publications · 128 citations

    5

    h-index

  3. NT
    Nina Tutunjyan

    IMEC, Belgium

    2 publications · 54 citations

    2

    h-index

  4. LC
    Le Chang

    Tsinghua University, China

    2 publications · 90 citations

    2

    h-index

  5. DG
    David Grant

    University of Minnesota, United States

    2 publications · 36 citations

    2

    h-index

1–5 of 493

Institutions

132

  1. Nanyang Technological University

    Singapore, Singapore

    5 h-index

    12 publications

    332 citations

  2. IMEC

    Leuven, Belgium

    4 h-index

    33 publications

    907 citations

  3. Tsinghua University

    Beijing, China

    4 h-index

    12 publications

    475 citations

  4. Imperial College London

    London, United Kingdom

    4 h-index

    9 publications

    124 citations

  5. Georgia Institute of Technology

    Atlanta, United States

    3 h-index

    9 publications

    409 citations

  6. Institute of Microelectronics

    Singapore, Singapore

    3 h-index

    9 publications

    315 citations

  7. Massachusetts Institute of Technology

    Cambridge, United States

    3 h-index

    12 publications

    692 citations

  8. MIT Lincoln Laboratory

    Lexington, United States

    3 h-index

    12 publications

    692 citations

1–8 of 132

Venues

  1. Journal of Micromechanics and Microengineering

    JMM · 10 publications · 321 citations

    10

    h-index

  2. 9

    h-index

  3. Microelectronic Engineering

    6 publications · 162 citations

    6

    h-index

  4. Journal of Microelectromechanical Systems

    5 publications · 353 citations

    5

    h-index

  5. Applied Physics Letters

    4 publications · 285 citations

    4

    h-index

1–5