Concepedia

Multilayer Packaging Design

Multilayer Packaging Design is a packaging architecture that integrates multiple functional layers within a single system to enhance moisture barrier performance by combining materials with complementary protective properties.

32

Publications

1.2K

Citations

123

Authors

40

Institutions

Publications per year

2017–2026

8

Parents

Publications

32

Design of Compact Stacked-Patch Antennas in LTCC Multilayer Packaging Modules for Wireless Applications

Renfu Li, G. DeJean, M. Maeng et al. · IEEE Transactions on Advanced Packaging · 2004 · 94 citations

, , +16

Extension of shelf life of two fatty foods using a new antioxidant multilayer packaging containing green tea extract

Daniel Carrizo, Gonzalo Taborda Ocampo, Osvaldo Bosetti · Innovative Food Science & Emerging Technologies · 2015 · 83 citations

, , +17

A Multilayer Ceramic Multichip Module

Albert J. Blodgett · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1980 · 82 citations

, , +17

Multilayers of Renewable Nanostructured Materials with High Oxygen and Water Vapor Barriers for Food Packaging

Eva Pasquier, Bruno D. Mattos, Hanna Koivula et al. · ACS Applied Materials & Interfaces · 2022 · 82 citations · Full text

, , +17

The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging

Nurhalis Majid, S. Dabral, J. F. McDonald · Journal of Electronic Materials · 1989 · 79 citations

, , +16

1–5 of 32

Authors

123

  1. MM
    Manos M. Tentzeris

    Georgia Institute of Technology, United States

    4 publications · 147 citations

    4

    h-index

  2. JL
    J. Laskar

    Georgia Institute of Technology, United States

    3 publications · 136 citations

    3

    h-index

  3. RB
    Raquel Becerril

    Universidad de Zaragoza, Spain

    3 publications · 113 citations

    3

    h-index

  4. SP
    S. Pinel

    Georgia Institute of Technology, United States

    3 publications · 136 citations

    3

    h-index

  5. MM
    M. Maeng

    Georgia Institute of Technology, United States

    2 publications · 109 citations

    2

    h-index

1–5 of 123

Institutions

40

  1. Georgia Institute of Technology

    Atlanta, United States

    6 h-index

    32 publications

    1K citations

  2. Universidad de Zaragoza

    Zaragoza, Spain

    5 h-index

    12 publications

    530 citations

  3. Centre National de la Recherche Scientifique

    Paris, France

    2 h-index

    4 publications

    273 citations

  4. IBM (United States)

    Armonk, United States

    2 h-index

    3 publications

    102 citations

  5. Universidade Estadual de Campinas (UNICAMP)

    Campinas, Brazil

    1 h-index

    1 publications

    27 citations

  6. Bioingénierie et Dynamique Microbienne aux Interfaces Alimentaires

    Bourg-en-Bresse, France

    1 h-index

    1 publications

    27 citations

  7. Microsoft (United States)

    Redmond, United States

    1 h-index

    1 publications

    11 citations

  8. Aalto University

    Espoo, Finland

    1 h-index

    3 publications

    246 citations

1–8 of 40

Venues

  1. 2

    h-index

  2. Applied Surface Science

    2 publications · 60 citations

    2

    h-index

  3. IEEE MTT-S International Microwave Symposium Digest, 2005.

    Conference · 1 publications · 11 citations

    1

    h-index

  4. Journal of Electronic Materials

    JEM · 1 publications · 79 citations

    1

    h-index

  5. Food Packaging and Shelf Life

    1 publications · 28 citations

    1

    h-index

1–5