S. Pinel - Concepedia

Author

S. Pinel

Georgia Institute of Technology

Also Known As

Pinel, S., S Pinel, S. Pinel, Stphane Pinel

Publications

1.9K

Citations

H-Index

Concepts

All Affiliations

Georgia Institute of Technology Asahi Glass (Japan)HRL Laboratories (United States)

About

S. Pinel is an author at Georgia Institute of Technology specializing in engineering, antenna, and electromagnetic compatibility.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	19	38	1.5K
2	Electrical Engineering	15	24	1K
3	Computer Engineering	12	15	544
4	Materials Science	4	4	57
5	Mechanical Engineering	1	1	47

S. Pinel

Publications

1.6K

Citations

H-Index

Page 1

	Year	Citations
RF-system-on-package (SOP) for wireless communications Kyutae Lim, S. Pinel, M.F. Davis, IEEE Microwave Magazine Wireless CommunicationsEngineeringRadio FrequencyOscillatorsWireless Lan	2002	179
A V-band front-end with 3-D integrated cavity filters/duplexers and antenna in LTCC technologies Jong‐Hoon Lee, Nobutaka Kidera, G. DeJean, IEEE Transactions on Microwave Theory and Techniques EngineeringRadio FrequencyAntennaV-band Front-endCompact Duplexer	2006	132
Highly integrated millimeter-wave passive components using 3-D LTCC system-on-package (SOP) technology Jong‐Hoon Lee, G. DeJean, S. Sarkar, IEEE Transactions on Microwave Theory and Techniques Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)AntennaMultiplexing Filter	2005	110
3-D-Integrated RF and Millimeter-Wave Functions and Modules Using Liquid Crystal Polymer (LCP) System-on-Package Technology Manos M. Tentzeris, J. Laskar, John Papapolymerou, IEEE Transactions on Advanced Packaging Electrical EngineeringMillimeter-wave FunctionsEngineeringLiquid Crystal PolymerIntegration Approach	2004	108
Low-loss LTCC cavity filters using system-on-package technology at 60 GHz Jong‐Hoon Lee, S. Pinel, John Papapolymerou, IEEE Transactions on Microwave Theory and Techniques Electrical EngineeringEngineeringCavity ResonatorsSystem-on-package TechnologyAntenna	2005	107
Design of Compact Stacked-Patch Antennas in LTCC Multilayer Packaging Modules for Wireless Applications Renfu Li, G. DeJean, M. Maeng, IEEE Transactions on Advanced Packaging Ltcc LayersChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Antenna	2004	94
A compact LTCC-based Ku-band transmitter module Chang-Ho Lee, A. Sutono, Sangwoo Han, IEEE Transactions on Advanced Packaging Electrical EngineeringEngineeringLtcc 951AtRadio FrequencyMixed-signal Integrated Circuit	2002	85
Integrated RF architectures in fully-organic SOP technology M.F. Davis, A. Sutono, Sang‐Woong Yoon, IEEE Transactions on Advanced Packaging Microwave CircuitsElectrical EngineeringMultilayer Substrate TechnologyEngineeringMultilayer Organic	2002	56
Linear Tapered Cavity-Backed Slot Antenna for Millimeter-Wave LTCC Modules I. K. Kim, Nobutaka Kidera, S. Pinel, IEEE Antennas and Wireless Propagation Letters EngineeringAntennaLtcc SubstrateMicrowave AntennaMicrowave Ceramic	2006	52
Thermal modeling and management in ultrathin chip stack technology S. Pinel, A. Marty, Josiane Tasselli, IEEE Transactions on Components and Packaging Technologies EngineeringEnergy EfficiencyMechanical EngineeringComputer ArchitectureAdvanced Packaging (Semiconductors)	2002	47

Page 1