IEEE Transactions on Microwave Theory and Techniques · 2005 · 107 citations · 20 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringWireless CommunicationsMicrowave FiltersMicrowave Integrated CircuitsMicrowave PackagingMicrowave Semiconductor DevicesMillimeter-wave CommunicationsRadio-frequency Integrated CircuitsBandwidthCavity ResonatorsInsertion LossMeasurementMonolithic Microwave Integrated CircuitsReturn LossSystem-in-packageSystem-in-package Integration
In this paper, three-dimensional (3-D) integrated cavity resonators and filters consisting of via walls are demonstrated as a system-on-package compact solution for RF front-end modules at 60 GHz using low-temperature cofired ceramic (LTCC) technology. Slot excitation with a /spl lambda/g/4 open stub has been applied and evaluated in terms of experimental performance and fabrication accuracy and simplicity. The strongly coupled cavity resonator provides an insertion loss <0.84 dB, a return loss >20.6 dB over the passband (/spl sim/0.89 GHz), and a 3-dB bandwidth of approximately 1.5% (/spl sim/0.89 GHz), as well as a simple fabrication of the feeding structure (since it does not require to drill vias to implement the feeding structure). The design has been utilized to develop a 3-D low-loss three-pole bandpass filter for 60-GHz wireless local area network narrow-band (/spl sim/1 GHz) applications. This is the first demonstration entirely authenticated by measurement data for 60-GHz 3-D LTCC cavity filters. This filter exhibits an insertion loss of 2.14 dB at the center frequency of 58.7 GHz, a rejection >16.4 dB over the passband, and a 3-dB bandwidth approximately 1.38% (/spl sim/0.9 GHz).
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Journal of the Franklin Institute · 1963 · 5.8K citations
Foundations for Microwave Engineering
P.J.B. Clarricoats · Electronics and Power · 1967 · 2.7K citations
D.M. Pozar · Proceedings of the IEEE · 1992 · 674 citations