Concepedia

System-in-package

System-In-Package is a microwave packaging approach that integrates multiple functional components, such as active devices, passive elements, and interconnects, within a single compact package to achieve enhanced performance, miniaturization, and improved reliability in high-frequency applications.

198

Publications

6.8K

Citations

813

Authors

203

Institutions

Publications per year

2017–2026

40

Variants

Sip

Parents

Publications

198

Power distribution networks for system-on-package: status and challenges

Madhavan Swaminathan, Joungho Kim, István Novák et al. · IEEE Transactions on Advanced Packaging · 2004 · 262 citations

, , +17

An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices

Yueping Zhang, Junfa Mao · Proceedings of the IEEE · 2019 · 226 citations

, , +16

RF-system-on-package (SOP) for wireless communications

Kyutae Lim, S. Pinel, M.F. Davis et al. · IEEE Microwave Magazine · 2002 · 179 citations

, , +17

Thermal-driven multilevel routing for 3-D ICs

Jason Cong, Yan Zhang · 2005 · 153 citations

, , +16

The SOP for Miniaturized, Mixed-Signal Computing, Communication, and Consumer Systems of the Next Decade

Rao Tummala, Madhavan Swaminathan, Manos M. Tentzeris et al. · IEEE Transactions on Advanced Packaging · 2004 · 152 citations

, , +15

1–5 of 198

Authors

813

  1. JL
    J. Laskar

    Georgia Institute of Technology, United States

    17 publications · 1K citations

    15

    h-index

  2. RT
    Rao Tummala

    Georgia Institute of Technology, United States

    14 publications · 866 citations

    13

    h-index

  3. SP
    S. Pinel

    Georgia Institute of Technology, United States

    11 publications · 686 citations

    11

    h-index

  4. MM
    Manos M. Tentzeris

    Georgia Institute of Technology, United States

    13 publications · 704 citations

    11

    h-index

  5. JP
    John Papapolymerou

    Georgia Institute of Technology, United States

    9 publications · 438 citations

    9

    h-index

1–5 of 813

Institutions

203

  1. Georgia Institute of Technology

    Atlanta, United States

    19 h-index

    206 publications

    10.5K citations

  2. IMEC

    Leuven, Belgium

    6 h-index

    31 publications

    1.2K citations

  3. HRL Laboratories (United States)

    Malibu, United States

    5 h-index

    8 publications

    401 citations

  4. Karlsruhe Institute of Technology

    Karlsruhe, Germany

    5 h-index

    21 publications

    811 citations

  5. Philips (Netherlands)

    Amsterdam, The Netherlands

    5 h-index

    13 publications

    527 citations

  6. Industrial Technology Research Institute

    Hsinchu, Taiwan

    5 h-index

    21 publications

    565 citations

  7. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    5 h-index

    35 publications

    720 citations

  8. Korea Advanced Institute of Science and Technology

    Daejeon, South Korea

    5 h-index

    16 publications

    655 citations

1–8 of 203

Venues

  1. IEEE Transactions on Advanced Packaging

    14 publications · 1K citations

    13

    h-index

  2. 8

    h-index

  3. IEEE Microwave Magazine

    5 publications · 316 citations

    5

    h-index

  4. 5

    h-index

  5. IEEE Microwave and Wireless Components Letters

    5 publications · 152 citations

    5

    h-index

1–5