Concepedia

Albert J. Blodgett

AJ

Statistics

Publications

2

Citations

294

H-Index

2

Active since

1980

Affiliations

IBM (United States)(Current)

Albert J. Blodgett is an author at IBM (United States) specializing in electrical engineering, electronic packaging, and computer engineering.

Top concepts

EngineeringMaterial ScienceMicroelectronicsAdvanced PackagingComputer EngineeringElectronic PackagingElectrical EngineeringHeat TransferPackage DesignApplied Physics

Publications per year

1980–1982

2

Publications

2

Thermal Conduction Module: A High-Performance Multilayer Ceramic Package

Albert J. Blodgett, D. R. Barbour · IBM Journal of Research and Development · 1982 · 212 citations

Engineering, Integrated Circuits, Thermal Conductivity +19

A Multilayer Ceramic Multichip Module

Albert J. Blodgett · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1980 · 82 citations

Engineering, Computer Architecture, Advanced Packaging (Semiconductors) +17

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