S. Dabral - Concepedia

Author

S. Dabral

Rensselaer Polytechnic Institute

Also Known As

S. Dabral, Sanjay Dabral, Shashank Dabral

Publications

656

Citations

H-Index

Concepts

All Affiliations

Rensselaer Polytechnic Institute Intel (United States)University at Albany, State University of New York

About

S. Dabral is an author at Rensselaer Polytechnic Institute specializing in engineering, materials science, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	12	439
2	Electrical Engineering	8	8	335
3	Applied Physics	5	5	121
4	Computer Engineering	3	3	96
5	Chemistry	1	1	16

S. Dabral

Publications

449

Citations

H-Index

Page 1

	Year	Citations
The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging Nurhalis Majid, S. Dabral, J. F. McDonald Journal of Electronic Materials Materials Science3D Ic ArchitectureElectrical EngineeringWafer Scale ProcessingEngineering	1989	78
Novel clamp circuits for IC power supply protection Timothy J. Maloney, S. Dabral Electrical EngineeringEngineeringHigh TemperatureCircuit SystemPower Circuit	1995	75
Novel clamp circuits for IC power supply protection Timothy J. Maloney, S. Dabral IEEE Transactions on Components Packaging and Manufacturing Technology Part C Electrical EngineeringEngineeringHigh TemperatureCircuit SystemPower Circuit	1996	59
Stress in thermally annealed parylene films S. Dabral, J. Van Etten, Xinshu Zhang, Journal of Electronic Materials Materials ScienceMaterials EngineeringMaterial AnalysisEngineeringApplied Physics	1992	52
Designing on-chip power supply coupling diodes for ESD protection and noise immunity S. Dabral, Robert Aslett, Timothy J. Maloney Journal of Electrostatics Electrical EngineeringEngineeringNoise ImmunityPower IcOn-chip Power Supply	1994	52
Jitter Amplification Characterization of Passive Clock Channels at 6.4 and 9.6 Gb/s Santanu Chaudhuri, Warren Anderson, John A. Bryan, EngineeringJitter Amplification CharacterizationJitter Amplification CharacteristicsClock RecoveryTiming Analysis	2006	25
α α′ α″ α‴ Poly-tetrafluoro-<i>p</i>-xylylene as an interlayer dielectric for thin film multichip modules and integrated circuits S. Dabral, X. Zhang, Xinheng Wu, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena High Thermal StabilityOptical MaterialsEngineeringOrganic ElectronicsOptoelectronic Devices	1993	23
Techniques for fabrication of wafer scale interconnections in multichip packages J. F. McDonald, H.T. Lin, H.J. Greub, IEEE Transactions on Components Hybrids and Manufacturing Technology Vlsi PackagingEngineeringIntegrated CircuitsWafer Scale ProcessingAdvanced Packaging (Semiconductors)	1989	19
Crystallinity properties of parylene-n affecting its use as an ILD in submicron integrated circuit technology Xinshu Zhang, S. Dabral, Chien Chiang, Thin Solid Films Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringApplied Physics	1995	16
Correlation between copper diffusion and phase change in parylene G.‐R. Yang, S. Dabral, Lü You, Journal of Electronic Materials Materials ScienceCopper DiffusionEngineeringDiffusion ResistanceDiffusion Process	1991	16

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