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The parylene-aluminum multilayer interconnection system for wafer scale integration and wafer scale hybrid packaging

Materials Science3D Ic ArchitectureElectrical EngineeringWafer Scale ProcessingEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)MicrofabricationWafer Scale IntegrationElectronic PackagingMicroelectronics3D PrintingScale Hybrid Packaging