Interconnect Variation Analysis

Interconnect Variation Analysis is a systematic method within interconnect design that characterizes and quantifies the deviations in electrical and physical properties of interconnect structures due to manufacturing process fluctuations, environmental conditions, and material inconsistencies, enabling reliability and performance assessment under variable operating scenarios.

83

Publications

3.7K

Citations

246

Authors

72

Institutions

Publications per year

2017–2026

5

Authors

246

  1. DS
    Duane S. Boning

    Massachusetts Institute of Technology, United States

    10 publications · 500 citations

    10

    h-index

  2. SN
    Sani Nassif

    IBM Research - Austin, United States

    9 publications · 1K citations

    9

    h-index

  3. ON
    O.S. Nakagawa

    Hewlett-Packard (United States), United States

    5 publications · 239 citations

    5

    h-index

  4. FC
    Flavio Canavero

    Politecnico di Torino, Italy

    5 publications · 284 citations

    5

    h-index

  5. SO
    Soo‐Young Oh

    Samsung Medical Center, South Korea

    4 publications · 221 citations

    4

    h-index

1–5 of 246

Venues

  1. IEEE Transactions on Electron Devices

    5 publications · 184 citations

    5

    h-index

  2. 4

    h-index

  3. 3

    h-index

  4. 3

    h-index

  5. Microelectronics Reliability

    2 publications · 63 citations

    2

    h-index

1–5