Dennis O. Ouma

Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing

B.E. Stine, Dennis O. Ouma, R. Divecha et al. · IEEE Transactions on Semiconductor Manufacturing · 1998 · 138 citations

Engineering, Pattern-dependent Effects, Mechanical Engineering +18

Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts

Dennis O. Ouma, Duane S. Boning, J.E. Chung et al. · IEEE Transactions on Semiconductor Manufacturing · 2002 · 135 citations

Chemical-mechanical Polishing, Engineering, Mechanical Engineering +22

An integrated characterization and modeling methodology for CMP dielectric planarization

Dennis O. Ouma, Duane S. Boning, J.E. Chung et al. · 2002 · 54 citations

Engineering, Oxide Planarization, Computer-aided Design +20

Pattern Dependent Modeling for CMP Optimization and Control

Duane S. Boning, ByungKun Lee, Charles Oji et al. · MRS Proceedings · 1999 · 29 citations

Pattern Dependent Modeling, Engineering, Model-based Control Technique +6

EFFECT OF FINE-LINE DENSITY AND PITCH ON INTERCONNECT ILD THICKNESS VARIATION IN OXIDE CMP PROCESSES

R. Divecha, B.E. Stine, Dennis O. Ouma et al. · 1997 · 19 citations