J.E. Chung - Concepedia

Author

J.E. Chung

Massachusetts Institute of Technology

Also Known As

J. Chung, J. E. Chung, J.E. Chung, Jack Chen Ong Chung, Ji-young Chung, Joshua Chung

Publications

2.6K

Citations

H-Index

Concepts

All Affiliations

Massachusetts Institute of Technology University of California, Berkeley Hewlett-Packard (United States)IIT@MIT Texas Instruments (United States)

About

J.E. Chung is an author at Massachusetts Institute of Technology specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	28	48	2.5K
2	Applied Physics	19	29	1.6K
3	Education	3	3	108
4	Medicine	1	1	15
5	Biostatistics	1	1	14

J.E. Chung

Publications

2.5K

Citations

H-Index

Page 1

	Year	Citations
Measurement and modeling of self-heating in SOI nMOSFET's L.T. Su, J.E. Chung, D.A. Antoniadis, IEEE Transactions on Electron Devices Device ModelingSoi NmosfetElectrical EngineeringSoi Device DesignEngineering	1994	329
Analysis and decomposition of spatial variation in integrated circuit processes and devices B.E. Stine, Duane S. Boning, J.E. Chung IEEE Transactions on Semiconductor Manufacturing EngineeringIndustrial EngineeringSpatial VariationComputer-aided DesignIntegrated Circuits	1997	224
The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes B.E. Stine, Duane S. Boning, J.E. Chung, IEEE Transactions on Electron Devices EngineeringMechanical EngineeringChemical EngineeringPhysical Design (Electronics)Advanced Packaging (Semiconductors)	1998	159
Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing B.E. Stine, Dennis O. Ouma, R. Divecha, IEEE Transactions on Semiconductor Manufacturing EngineeringPattern-dependent EffectsMechanical EngineeringInterconnect (Integrated Circuits)Physical Design (Electronics)	1998	138
Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts Dennis O. Ouma, Duane S. Boning, J.E. Chung, IEEE Transactions on Semiconductor Manufacturing Chemical-mechanical PolishingEngineeringMechanical EngineeringChemical EngineeringWafer Scale Processing	2002	135
A model for hot-electron-induced MOSFET linear-current degradation based on mobility reduction due to interface-state generation J.E. Chung, P.K. Ko, Chenming Hu IEEE Transactions on Electron Devices EngineeringPower ElectronicsSemiconductor DeviceMosfet Linear-current DriveNanoelectronics	1991	107
Low-voltage hot-electron currents and degradation in deep-submicrometer MOSFETs J.E. Chung, M.-C. Jeng, J.E. Moon, IEEE Transactions on Electron Devices Semiconductor TechnologyElectrical EngineeringDrain BiasesEngineeringSemiconductor Device	1990	103
Deep-submicrometer channel design in silicon-on-insulator (SOI) MOSFET's L.T. Su, J.B. Jacobs, J.E. Chung, IEEE Electron Device Letters Device ModelingElectrical EngineeringDeep-submicrometer Channel DesignVlsi DesignDeep-submicrometer Soi Mosfet	1994	94
Deep-submicrometer MOS device fabrication using a photoresist-ashing technique J.E. Chung, M.-C. Jeng, J.E. Moon, IEEE Electron Device Letters Optical MaterialsEngineeringElectron-beam LithographyOptoelectronic DevicesIntegrated Circuits	1988	93
Two-stage hot-carrier degradation and its impact on submicrometer LDD NMOSFET lifetime prediction V. W. S. Chan, J.E. Chung IEEE Transactions on Electron Devices Electrical EngineeringDegradation Rate CoefficientEngineeringLdd Nmosfet LifetimeSemiconductor Device	1995	84

Page 1