J.E. Chung

Measurement and modeling of self-heating in SOI nMOSFET's

L.T. Su, J.E. Chung, D.A. Antoniadis et al. · IEEE Transactions on Electron Devices · 1994 · 329 citations

Device Modeling, Soi Nmosfet, Electrical Engineering +13

Analysis and decomposition of spatial variation in integrated circuit processes and devices

B.E. Stine, Duane S. Boning, J.E. Chung · IEEE Transactions on Semiconductor Manufacturing · 1997 · 224 citations

Engineering, Industrial Engineering, Spatial Variation +19

The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes

B.E. Stine, Duane S. Boning, J.E. Chung et al. · IEEE Transactions on Electron Devices · 1998 · 159 citations

Engineering, Mechanical Engineering, Chemical Engineering +21

Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing

B.E. Stine, Dennis O. Ouma, R. Divecha et al. · IEEE Transactions on Semiconductor Manufacturing · 1998 · 138 citations

Engineering, Pattern-dependent Effects, Mechanical Engineering +18

Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts

Dennis O. Ouma, Duane S. Boning, J.E. Chung et al. · IEEE Transactions on Semiconductor Manufacturing · 2002 · 135 citations

Chemical-mechanical Polishing, Engineering, Mechanical Engineering +22