L.T. Su

Full copper wiring in a sub-0.25 μm CMOS ULSI technology

D. Edelstein, J. Heidenreich, R. Goldblatt et al. · 2002 · 350 citations

3D Ic Architecture, Electrical Engineering, Cu Wiring +8

Measurement and modeling of self-heating in SOI nMOSFET's

L.T. Su, J.E. Chung, D.A. Antoniadis et al. · IEEE Transactions on Electron Devices · 1994 · 329 citations

Device Modeling, Soi Nmosfet, Electrical Engineering +13

Deep-submicrometer channel design in silicon-on-insulator (SOI) MOSFET's

L.T. Su, J.B. Jacobs, J.E. Chung et al. · IEEE Electron Device Letters · 1994 · 94 citations

Device Modeling, Electrical Engineering, Deep-submicrometer Channel Design +12

Annealing-temperature dependence of the thermal conductivity of LPCVD silicon-dioxide layers

Kenneth E. Goodson, M. I. Flik, L.T. Su et al. · IEEE Electron Device Letters · 1993 · 92 citations

Materials Science, Electrical Engineering, Electronic Circuits +14

Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers

Kenneth E. Goodson, M. I. Flik, L.T. Su et al. · Journal of Heat Transfer · 1994 · 85 citations

Engineering, Bulk Conductivity, Silicon On Insulator +16