R. Divecha

Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing

B.E. Stine, Dennis O. Ouma, R. Divecha et al. · IEEE Transactions on Semiconductor Manufacturing · 1998 · 138 citations

Engineering, Pattern-dependent Effects, Mechanical Engineering +18

Using a statistical metrology framework to identify systematic and random sources of die- and wafer-level ILD thickness variation in CMP processes

E. Chang, B.E. Stine, T. Maung et al. · 2002 · 46 citations

Engineering, Vlsi Design, Measurement +21

A Broad-Band Lumped Element Analytic Model Incorporating Skin Effect and Substrate Loss for Inductors and Inductor Like Components for Silicon Technology Performance Assessment and RFIC Design

F.M. Rotella, V. Blaschke, M. Matloubian et al. · IEEE Transactions on Electron Devices · 2005 · 36 citations

Engineering, Radio Frequency, Power Electronics +17

EFFECT OF FINE-LINE DENSITY AND PITCH ON INTERCONNECT ILD THICKNESS VARIATION IN OXIDE CMP PROCESSES

R. Divecha, B.E. Stine, Dennis O. Ouma et al. · 1997 · 19 citations

Assessing and characterizing inter-and intra-die variation using a statistical metrology framework: A CMP case study

R. Divecha, B.E. Stine, E. Chang et al. · Computer Standards & Interfaces · 1999 · 14 citations

Engineering, Measurement, Uncertainty Quantification +7