B.E. Stine

Analysis and decomposition of spatial variation in integrated circuit processes and devices

B.E. Stine, Duane S. Boning, J.E. Chung · IEEE Transactions on Semiconductor Manufacturing · 1997 · 224 citations

Engineering, Industrial Engineering, Spatial Variation +19

The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes

B.E. Stine, Duane S. Boning, J.E. Chung et al. · IEEE Transactions on Electron Devices · 1998 · 159 citations

Engineering, Mechanical Engineering, Chemical Engineering +21

Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing

B.E. Stine, Dennis O. Ouma, R. Divecha et al. · IEEE Transactions on Semiconductor Manufacturing · 1998 · 138 citations

Engineering, Pattern-dependent Effects, Mechanical Engineering +18

Using a statistical metrology framework to identify systematic and random sources of die- and wafer-level ILD thickness variation in CMP processes

E. Chang, B.E. Stine, T. Maung et al. · 2002 · 46 citations

Engineering, Vlsi Design, Measurement +21

A simulation methodology for assessing the impact of spatial/pattern dependent interconnect parameter variation on circuit performance

B.E. Stine, Vikas Mehrotra, Duane S. Boning et al. · 2002 · 31 citations

Engineering, Vlsi Design, Computer Architecture +20