Vikas Mehrotra

A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance

Vikas Mehrotra, Shiou Lin Sam, Duane S. Boning et al. · 2000 · 109 citations · Full text

Poly Cd Variation, Engineering, Vlsi Design +16

Modeling the effects of manufacturing variation on high-speed microprocessor interconnect performance

Vikas Mehrotra, Sani Nassif, Duane S. Boning et al. · 2002 · 72 citations

Physical Design (Electronics), Engineering, Vlsi Design +12

Technology scaling impact of variation on clock skew and interconnect delay

Vikas Mehrotra, Duane S. Boning · 2001 · 59 citations

Engineering, Vlsi Design, Computer Architecture +16

A simulation methodology for assessing the impact of spatial/pattern dependent interconnect parameter variation on circuit performance

B.E. Stine, Vikas Mehrotra, Duane S. Boning et al. · 2002 · 31 citations

Engineering, Vlsi Design, Computer Architecture +20

Conductor requirements for high-temperature superconducting utility power transformers

E.F. Pleva, Vikas Mehrotra, S.W. Schwenterly · Superconductor Science and Technology · 2009 · 18 citations

Superconducting Material, Electrical Engineering, High-tc Superconductivity +12