Duane S. Boning

Analysis and decomposition of spatial variation in integrated circuit processes and devices

B.E. Stine, Duane S. Boning, J.E. Chung · IEEE Transactions on Semiconductor Manufacturing · 1997 · 228 citations

Engineering, Computer Engineering, Electrical Engineering +17

The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes

B.E. Stine, Duane S. Boning, J.E. Chung et al. · IEEE Transactions on Electron Devices · 1998 · 159 citations

Natural Sciences, Electrical Engineering, Materials Science +10

Towards Fast Computation of Certified Robustness for ReLU Networks

Tsui-Wei Weng, Huan Zhang, Hongge Chen et al. · arXiv (Cornell University) · 2018 · 153 citations · Full text

Computing, Computer Science, Mathematics +15

Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing

B.E. Stine, Dennis O. Ouma, R. Divecha et al. · IEEE Transactions on Semiconductor Manufacturing · 1998 · 139 citations

Engineering, Electrical Engineering, Materials Science +16

Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts

Dennis O. Ouma, Duane S. Boning, J.E. Chung et al. · IEEE Transactions on Semiconductor Manufacturing · 2002 · 136 citations

Engineering, Electrical Engineering, Materials Science +17