E. Chang

Using a statistical metrology framework to identify systematic and random sources of die- and wafer-level ILD thickness variation in CMP processes

E. Chang, B.E. Stine, T. Maung et al. · 2002 · 46 citations

Engineering, Vlsi Design, Measurement +21

Assessing and characterizing inter-and intra-die variation using a statistical metrology framework: A CMP case study

R. Divecha, B.E. Stine, E. Chang et al. · Computer Standards & Interfaces · 1999 · 14 citations

Engineering, Measurement, Uncertainty Quantification +7

Statistical metrology for characterizing CMP processes

Sharad Prasad, W. Loh, A. Kapoor et al. · Microelectronic Engineering · 1997 · 12 citations

Engineering, Measurement, Uncertainty Quantification +7