Damage-free Etching
Damage-Free Etching is a thin film etching technique that selectively removes material without inducing physical or chemical damage to the underlying or remaining layers, distinguishing itself from conventional etching methods by preserving the structural and electronic integrity of the substrate.
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2.3K
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389
Authors
103
Institutions
Publications per year
2017–2026
18
Parents
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Seiji Samukawa, Hiroto Ohtake, Tetsu Mieno · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1996 · 105 citations
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103

Tohoku University
Sendai, Japan
12 h-index
45 publications
1.3K citations
NEC (Japan)
Tokyo, Japan
8 h-index
20 publications
883 citations
Hitachi (Japan)
Tokyo, Japan
5 h-index
18 publications
391 citations
IMEC
Leuven, Belgium
4 h-index
14 publications
359 citations

National Institute of Advanced Industrial Science and Technology
Tsukuba, Japan
4 h-index
30 publications
681 citations

Hokkaido University
Sapporo, Japan
3 h-index
7 publications
174 citations

Centre National de la Recherche Scientifique
Paris, France
3 h-index
11 publications
314 citations
Groupe de Recherches sur l'Energétique des Milieux Ionisés
Orléans, France
3 h-index
11 publications
330 citations
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JJAP · 8 publications · 276 citations
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7 publications · 176 citations
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7 publications · 193 citations
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4 publications · 161 citations
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3 publications · 87 citations
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