Damage-free Etching

Damage-Free Etching is a thin film etching technique that selectively removes material without inducing physical or chemical damage to the underlying or remaining layers, distinguishing itself from conventional etching methods by preserving the structural and electronic integrity of the substrate.

75

Publications

2.3K

Citations

389

Authors

103

Institutions

Publications per year

2017–2026

18

Authors

389

  1. SS
    Seiji Samukawa

    Tohoku University, Japan

    17 publications · 778 citations

    14

    h-index

  2. KS
    Keizô Suzuki

    Hitachi (Japan), Japan

    3 publications · 64 citations

    3

    h-index

  3. MR
    Mikhaı̈l R. Baklanov

    IMEC, Belgium

    3 publications · 77 citations

    3

    h-index

  4. SN
    Shuichi Noda

    Tohoku University, Japan

    3 publications · 86 citations

    3

    h-index

  5. SD
    Stefan De Gendt

    IMEC, Belgium

    3 publications · 76 citations

    3

    h-index

1–5 of 389

Venues

  1. Japanese Journal of Applied Physics

    JJAP · 8 publications · 276 citations

    8

    h-index

  2. 7

    h-index

  3. Applied Physics Letters

    7 publications · 193 citations

    7

    h-index

  4. Journal of Applied Physics

    4 publications · 161 citations

    4

    h-index

  5. IEEE Transactions on Electron Devices

    3 publications · 87 citations

    3

    h-index

1–5