B. Fléchet

High frequency characterization and modeling of high density TSV in 3D integrated circuits

C. Bermond, L. Cadix, A. Farcy et al. · 2009 · 62 citations

Engineering, Electrical Engineering, Materials Science +17

Investigation on TSV impact on 65nm CMOS devices and circuits

H. Chaabouni, Maxime Rousseau, Philip R. LeDuc et al. · 2010 · 54 citations

Engineering, Computer Engineering, Electrical Engineering +17

Time domain characterization of lossy arbitrary characteristic impedance transmission lines

Philippe Ferrari, B. Fléchet, G. Angénieux · IEEE Microwave and Guided Wave Letters · 1994 · 37 citations

Engineering, Electrical Engineering, Circuit Theory +16

Frequency Effect on Voltage Linearity of $ \hbox{ZrO}_{2}$-Based RF Metal–Insulator–Metal Capacitors

T. Bertaud, S. Blonkowski, C. Bermond et al. · IEEE Electron Device Letters · 2010 · 31 citations

Engineering, Electrical Engineering, Materials Science +17

Ferroelectric properties of Pb(Zr,Ti)O3 thin films until 40 GHz

Emmanuel Defaÿ, T. Lacrevaz, Trinh Vo et al. · Applied Physics Letters · 2009 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +17