B. Fléchet - Concepedia

Author

B. Fléchet

Université Savoie Mont Blanc

Also Known As

B. Flechet, B. Fléchet, Bermond, C., Flechet, B., Fléchet, B.

109

Publications

557

Citations

H-Index

Concepts

All Affiliations

Université Savoie Mont Blanc Institut de Microélectronique, Electromagnétisme et Photonique STMicroelectronics (France)CEA Grenoble Commissariat à l'Énergie Atomique et aux Énergies Alternatives

About

B. Fléchet is an author at Université Savoie Mont Blanc specializing in engineering, electrical engineering, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	16	398
2	Electrical Engineering	12	13	338
3	Applied Physics	10	11	286
4	Computer Engineering	7	7	160
5	Education	1	1	24

B. Fléchet

Publications

421

Citations

H-Index

Page 1

	Year	Citations
High frequency characterization and modeling of high density TSV in 3D integrated circuits C. Bermond, L. Cadix, A. Farcy, High Density TsvEngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic Compatibility	2009	62
Investigation on TSV impact on 65nm CMOS devices and circuits H. Chaabouni, Maxime Rousseau, Philip R. LeDuc, Low-power Electronics3D Ic ArchitectureElectrical EngineeringIsolated MosfetEngineering	2010	54
Time domain characterization of lossy arbitrary characteristic impedance transmission lines Philippe Ferrari, B. Fléchet, G. Angénieux IEEE Microwave and Guided Wave Letters Transmission LinesElectrical EngineeringEngineeringMicrowave TransmissionAntenna	1994	37
Frequency Effect on Voltage Linearity of $ \hbox{ZrO}_{2}$-Based RF Metal–Insulator–Metal Capacitors T. Bertaud, S. Blonkowski, C. Bermond, IEEE Electron Device Letters Materials ScienceElectrical EngineeringDielectricsFrequency EffectWideband Frequency Characterizations	2010	31
Ferroelectric properties of Pb(Zr,Ti)O3 thin films until 40 GHz Emmanuel Defaÿ, T. Lacrevaz, Trinh Vo, Applied Physics Letters Materials ScienceMultiferroicsOptical MaterialsElectrical EngineeringEngineering	2009	26
RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking L. Cadix, C. Bermond, C. Fuchs, Microelectronic Engineering High Density3D Ic ArchitectureElectrical EngineeringPhysical Design (Electronics)Engineering	2009	25
A complete calibration procedure for time domain network analyzers Philippe Ferrari, G. Angénieux, B. Fléchet Wireless CommunicationsEngineeringMeasurementNetwork AnalysisEducation	2003	24
Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs L. Cadix, Maxime Rousseau, C. Fuchs,	2010	23
Intercomparison of permittivity measurement techniques for ferroelectric thin layers Patrick Quéffélec, Vincent Laur, Alexis Chevalier, Journal of Applied Physics Materials ScienceMaterials EngineeringElectrical EngineeringError AnalysisEngineering	2014	22
Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors T. Bertaud, C. Bermond, T. Lacrevaz, Microelectronic Engineering Materials ScienceHfo2 FilmsEngineeringOxide ElectronicsWideband Frequency	2009	18

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