N. Hotellier

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 90 citations

Engineering, Image Sensor, Cmos Image Sensor +16

Fully Optimized Cu based process with dedicated cavity etch for 1.75μm and 1.45μm pixel pitch CMOS Image Sensors

Muriel Cohen, F. Roy, Didier Hérault et al. · 2006 · 45 citations · Full text

Electrical Engineering, Wafer Scale Processing, Engineering +13

Effect of intermetallic compound thickness on shear strength of 25 μm diameter Cu-pillars

Julien Bertheau, F. Hodaj, N. Hotellier et al. · Intermetallics · 2014 · 35 citations

Materials Science, Engineering, Mechanical Properties +9

Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results

David Henry, Jean Charbonnier, P. Chausse et al. · 2008 · 33 citations

Electrical Resistance, Electrical Results, Engineering +18

Towards efficient and reliable 300mm 3D technology for wide I/O interconnects

P. Coudrain, Jean-Philippe Colonna, C. Aumont et al. · 2012 · 19 citations

Engineering, Device Integration, Cmos Node +20