C. Aumont

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

P. Coudrain, P. Chausse, L. Arnaud et al. · 2019 · 63 citations

Engineering, Successful Structural Test, Computer Architecture +16

New mechanism of plasma induced damage on CMOS image sensor: Analysis and process optimization

J.-P. Carrere, J.-P. Oddou, S. Placé et al. · Solid-State Electronics · 2011 · 24 citations

New Mechanism, Process Optimization, Plasma Processing +2

Towards efficient and reliable 300mm 3D technology for wide I/O interconnects

P. Coudrain, Jean-Philippe Colonna, C. Aumont et al. · 2012 · 19 citations

Engineering, Device Integration, Cmos Node +20

Study of dynamical formation and shape of microlenses formed by the reflow method

Stéphanie Audran, B. Faure, B. Mortini et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2006 · 19 citations

Colloidal Material, Engineering, Microlenses Arrays +21

Electrical and morphological assessment of via middle and backside process technology for 3D integration

Jean-Philippe Colonna, P. Coudrain, G. Garnier et al. · 2012 · 14 citations

Engineering, Industrial Engineering, Cmos Node +18