Jean-Philippe Colonna

Author

Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Also Known As

Colonna, J. P., Colonna, Jean-Philippe, J P Colonna, J-P Colonna, J. P. Colonna, J.-P Colonna, J.-P. Colonna, J.P. Colonna, Jean-Philippe Colonna

Publications

385

Citations

H-Index

Concepts

All Affiliations

Commissariat à l'Énergie Atomique et aux Énergies Alternatives Institut polytechnique de Grenoble CEA Grenoble Laboratoire d'Électronique des Technologies de l'Information Université Grenoble Alpes

About

Jean-Philippe Colonna is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	12	228
2	Electrical Engineering	10	11	207
3	Applied Physics	7	7	154
4	Computer Engineering	6	6	93
5	Industrial Engineering	1	1	14

Jean-Philippe Colonna

Publications

249

Citations

H-Index

Page 1

	Year	Citations
Explanation of the Charge-Trapping Properties of Silicon Nitride Storage Layers for NVM Devices Part I: Experimental Evidences From Physical and Electrical Characterizations Elisa Vianello, F. Driussi, L. Perniola, IEEE Transactions on Electron Devices Non-volatile MemoryEngineeringCharge-trapping PropertiesElectrical CharacterizationsSi-rich Sin	2011	35
Limit to the erbium ions emission in silicon-rich oxide films by erbium ion clustering N. Prtljaga, Daniel Navarro‐Urrios, A. Tengattini, Optical Materials Express Optical MaterialsEngineeringLuminescent GlassErbium Ions.bySilicon On Insulator	2012	27
Investigation of hafnium-aluminate alloys in view of integration as interpoly dielectrics of future Flash memories G. Molas, M. Bocquet, Julien Buckley, Solid-State Electronics Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringFlash Memory	2007	22
Thermal performance of 3D ICs: Analysis and alternatives Cristiano Santos, Pascal Vivet, Jean-Philippe Colonna, EngineeringEnergy EfficiencyComputer ArchitectureIntegration TechnologyInterconnect (Integrated Circuits)	2014	21
Growth and Thermal Stability of SiGe/Si Superlattices on Bulk Si Wafers Jean‐Michel Hartmann, Anne‐Marie Papon, Jean-Philippe Colonna, ECS Transactions Materials EngineeringMaterials ScienceWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)	2008	21
Towards efficient and reliable 300mm 3D technology for wide I/O interconnects P. Coudrain, Jean-Philippe Colonna, C. Aumont, EngineeringDevice IntegrationCmos NodeComputer ArchitectureInterconnect (Integrated Circuits)	2012	19
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits P. Coudrain, Papa Momar Souaré, R. Prieto, IEEE Design and Test EngineeringEnergy EfficiencyIntegrated CircuitsInterconnect (Integrated Circuits)Refrigeration	2015	18
Oxidation of Suspended Stacked Silicon Nanowire for Sub-10nm Cross-Section Shape Optimization Alexandre Hubert, Jean-Philippe Colonna, Stéphane Bécu, ECS Transactions EngineeringThermal OxidationSilicon On InsulatorInterconnect (Integrated Circuits)Semiconductor Device	2008	17
Electrical and morphological assessment of via middle and backside process technology for 3D integration Jean-Philippe Colonna, P. Coudrain, G. Garnier, EngineeringIndustrial EngineeringCmos NodeComputer ArchitectureComputer-aided Design	2012	14
Bipolar pulsed excitation of erbium-doped nanosilicon light emitting diodes Aleksei Anopchenko, A. Tengattini, A. Marconi, Journal of Applied Physics Electrical EngineeringSolid-state LightingEngineeringPhotoluminescencePhysics	2012	13

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