Concepedia
Intermetallics · 2014 · 35 citations · 32 references
Materials ScienceEngineeringMechanical PropertiesMechanical BehaviorStrength PropertyMechanical EngineeringMicrostructure-strength RelationshipμM Diameter Cu-pillarsShear StrengthIntermetallic Compound ThicknessThin-walled StructureMechanics Of Materials
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Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations
Reliability, Electrical Engineering, Reliability Engineering +10
Interfacial reactions between lead-free solders and common base materials
Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations
Materials Science, Interfacial Reactions, Engineering +4
Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 435 citations
Engineering, Mechanical Engineering, Kirkendall Void Formation +16
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
Jianfeng Li, Pearl Agyakwa, C. Mark Johnson · Acta Materialia · 2010 · 391 citations
Materials Engineering, Materials Science, Interfacial Reaction +10
Bonding, structure, and properties of metal/ceramic interfaces: Part 1 Chemical bonding, chemical reaction, and interfacial structure
James M. Howe · International Materials Reviews · 1993 · 255 citations