Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

The kinetics of precipitation from supersaturated solid solutions

I.M. Lifshitz, V.V. Slyozov · Journal of Physics and Chemistry of Solids · 1961 · 8.2K citations

Materials Science, Engineering, Phase Equilibrium +5

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations

Reliability, Electrical Engineering, Reliability Engineering +10

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

Materials Science, Interfacial Reactions, Engineering +4

Properties of lead-free solder alloys with rare earth element additions

Chi‐Man Lawrence Wu, Daquan Yu, C. Law et al. · Materials Science and Engineering R Reports · 2004 · 583 citations

Materials Science, Materials Engineering, Rare Earth Mineral +8

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Mechanical Engineering, Chemistry +17