Publication | Closed Access
Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
391
Citations
40
References
2010
Year
Materials EngineeringMaterials ScienceInterfacial ReactionInterfacial ProcessEngineeringCorrosionApplied PhysicsMetallurgical InteractionMetallurgical ProcessTransient Liquid PhaseMicrostructureMetal ProcessingCu/sn/cu System
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