Concepedia

Pearl Agyakwa

PA

25

Publications

1.3K

Citations

16

H-Index

2009

Active since

Affiliations

University of Nottingham(Current)

Loughborough University

University of Oxford

Pearl Agyakwa is an author at University of Nottingham specializing in engineering, materials science, and applied physics.

Top concepts

EngineeringApplied PhysicsMaterial ScienceElectronic PackagingMaterials EngineeringElectrical EngineeringMicrostructureMicroelectronicsMechanical EngineeringMechanics Of Materials

Publications per year

2009–2024

25

Publications

25

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Jianfeng Li, Pearl Agyakwa, C. Mark Johnson · Acta Materialia · 2010 · 391 citations

Materials Engineering, Materials Science, Interfacial Reaction +10

Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules

Li Yang, Pearl Agyakwa, C. Mark Johnson · IEEE Transactions on Device and Materials Reliability · 2012 · 175 citations · Full text

Power Electronic Modules, Engineering, Wire Bond Interconnects +18

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

Jianfeng Li, Pearl Agyakwa, C. Mark Johnson · Acta Materialia · 2010 · 175 citations

Materials Science, Materials Engineering, Ag–sn–ag System +6

Degradation of thermal interface materials for high-temperature power electronics applications

Robert Skuriat, Jianfeng Li, Pearl Agyakwa et al. · Microelectronics Reliability · 2013 · 66 citations · Full text

Engineering, Cu Stack Sample, Cu Stack Samples +19

Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate

Jianfeng Li, Pearl Agyakwa, C. Mark Johnson · Journal of Alloys and Compounds · 2012 · 61 citations · Full text

Aluminium Nitride, Growth Rates, Imc Growth +16

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