Li Yang

Physics-of-Failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules

Li Yang, Pearl Agyakwa, C. Mark Johnson · IEEE Transactions on Device and Materials Reliability · 2012 · 175 citations · Full text

Power Electronic Modules, Engineering, Wire Bond Interconnects +18

SiC power MOSFETs performance, robustness and technology maturity

Alberto Castellazzi, Asad Fayyaz, G. Romano et al. · Microelectronics Reliability · 2016 · 113 citations · Full text

Electrical Engineering, Engineering, Power Device +4

Estimation, Minimization, and Validation of Commutation Loop Inductance for a 135-kW SiC EV Traction Inverter

Radha Sree Krishna Moorthy, Bryce Aberg, Marshal Olimmah et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2019 · 65 citations · Full text

Electrical Engineering, Engineering, Power Device +11

Short-circuit robustness of SiC Power MOSFETs: Experimental analysis

Alberto Castellazzi, Asad Fayyaz, Li Yang et al. · 2014 · 63 citations

Reliability, Electrical Engineering, Structural Characterization +14

High temperature gate-bias and reverse-bias tests on SiC MOSFETs

Li Yang, Alberto Castellazzi · Microelectronics Reliability · 2013 · 60 citations

Electrical Engineering, Engineering, Bias Temperature Instability +4