2014 · 63 citations · 7 references
ReliabilityElectrical EngineeringStructural CharacterizationEngineeringPower DeviceNanoelectronicsDegradation ProcessBias Temperature InstabilityApplied PhysicsPower Semiconductor DeviceSic Power MosfetsCircuit ReliabilityThorough Experimental CharacterizationPower ElectronicsElectronic PackagingMicroelectronicsDevice Reliability
This paper proposes a thorough experimental characterization of the performance of commercially available SiC Power MOSFETs under short-circuit conditions. The purpose is to assess and understand the degradation process and the failure mechanisms that limit device reliability to identify optimal routes for subsequent technology development. This paper complements electro-thermal functional tests with structural characterization offering deeper insight into device technology related aspects.
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Giovanni Breglio, Andrea Irace, Ettore Napoli et al. · IEEE Transactions on Electron Devices · 2012 · 64 citations
Engineering, Numerical Validation, Power Electronic Systems +18
Robustness of 1.2kV SiC MOSFET devices
D. Othman, Stéphane Lefebvre, Mounira Berkani et al. · Microelectronics Reliability · 2013 · 60 citations
Thermal instability effects in SiC Power MOSFETs
Alberto Castellazzi, Tsuyoshi Funaki, Tsunenobu Kimoto et al. · Microelectronics Reliability · 2012 · 49 citations