Juan Boon Tan

Thriving at work as a mediator of the relationship between psychological resilience and the work performance of clinical nurses

Zhou-Min Shen, Yangyang Wang, Yimin Cai et al. · BMC Nursing · 2024 · 45 citations · Full text

Management, Performance Management, Employee Engagement +12

HfO_x-Based RRAM Device With Sandwich-Like Electrode for Thermal Budget Requirement

Jianxun Sun, Juan Boon Tan, T. P. Chen · IEEE Transactions on Electron Devices · 2020 · 23 citations

Natural Sciences, Materials Engineering, Materials Science +17

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

Xuefen Ong, Soon Wee Ho, Yue Ying Ong et al. · Microelectronics Reliability · 2009 · 20 citations

Engineering, Materials Engineering, Packaging Design +7

Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low-$k$ Large-Die Flip Chip Package

J.M.G. Ong, A.A.O. Tay, Xiaowu Zhang et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 18 citations

Engineering, Electrical Engineering, Materials Engineering +17

Structural Design and Optimization of 65nm Cu/low-k Flipchip Package

Xiaowu Zhang, V. Kripesh, Yeow Kheng Lim et al. · 2007 · 11 citations

Engineering, Electrical Engineering, Materials Engineering +17