Mark Kelling

High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography

P. Agnello, T. Ivers, C. Warm et al. · 2006 · 115 citations

Engineering, Vlsi Design, Enhanced Strain +21

A holistic metrology approach: hybrid metrology utilizing scatterometry, CD-AFM, and CD-SEM

Alok Vaid, Bin Bin Yan, Yun Tao Jiang et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2011 · 65 citations

Engineering, Electron-beam Lithography, Measurement +19

Performance of tri-layer process required for 22 nm and beyond

Yayi Wei, Martin Glodde, Hakeem Yusuff et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2011 · 23 citations

Materials Science, Electrical Engineering, Wafer Scale Processing +15

A 45 nm CMOS node Cu/Low-k/ Ultra Low-k PECVD SiCOH (k=2.4) BEOL Technology

S. Sankaran, S. Arai, R. Augur et al. · 2006 · 22 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Hybrid metrology solution for 1X node technology

Alok Vaid, Alexander Elia, Mark Kelling et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2012 · 17 citations

Engineering, Electron-beam Lithography, Measurement +21