G. Biery

The electromigration short-length effect in Ti-AlCu-Ti metallization with tungsten studs

R. G. Filippi, G. Biery, R. Wachnik · Journal of Applied Physics · 1995 · 72 citations

Natural Sciences, Materials Engineering, Materials Science +15

A 7nm CMOS technology platform for mobile and high performance compute application

B. Jagannathan, Akihisa Ogino, D. Jaeger et al. · 2017 · 60 citations

Engineering, Computer Engineering, Electrical Engineering +14

A high performance 0.13 μm copper BEOL technology with low-k dielectric

R. Goldblatt, B. Agarwala, M.B. Anand et al. · 2002 · 30 citations

Engineering, Materials Engineering, Materials Science +15

Advanced gate stacks with fully silicided (FUSI) gates and high-/spl kappa/ dielectrics: enhanced performance at reduced gate leakage

E. P. Gusev, C. Cabral, Y.H. Kim et al. · 2004 · 28 citations

Engineering, Electrical Engineering, Materials Science +17

A high-performance sub-0.25 μm CMOS technology with multiple thresholds and copper interconnects

L.T. Su, R. Schulz, J. Adkisson et al. · 2002 · 26 citations

Engineering, Computer Engineering, Electrical Engineering +17