M.B. Anand

A high performance 0.13 μm copper BEOL technology with low-k dielectric

R. Goldblatt, B. Agarwala, M.B. Anand et al. · 2002 · 30 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Use of gas as low-k interlayer dielectric in LSI's: Demonstration of feasibility

M.B. Anand, Masao Yamada, H. Shibata · IEEE Transactions on Electron Devices · 1997 · 29 citations

Low-k Interlayer Dielectric, Engineering, Wire Capacitance +19

Multiobjective optimization of VLSI interconnect parameters

M.B. Anand, H. Shibata, M. Kakumu · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 1998 · 14 citations

Electrical Engineering, Chip Size, Engineering +14

Low resistance dual damascene process by new Al reflow using Nb liner

J. Wada, Y. Oikawa, T. Katata et al. · 2002 · 11 citations

Materials Science, Materials Engineering, Electrical Engineering +14