Highly reliable copper dual-damascene interconnects with self-formed MnSi/sub x/O/sub y/ barrier Layer

T. Usui, H. Nasu, S. Takahashi, +6

IEEE Transactions on Electron Devices

Materials ScienceEngineeringTunneling MicroscopyTransmission Electron MicroscopyAdvanced Packaging (Semiconductors) +13

High performance 35 nm gate length CMOS with NO oxynitride gate dielectric and Ni salicide

S. Inaba, K. Okano, Shôichi Matsuda, +22

IEEE Transactions on Electron Devices

Low-power ElectronicsNitrogen ConcentrationElectrical EngineeringEngineeringHigh Performance 35 +10

A 2-million-pixel CCD image sensor overlaid with an amorphous silicon photoconversion layer

Shiro Manabe, Y. Mastunaga, Akihiko Furukawa, +9

IEEE Transactions on Electron Devices

Photonic SensorElectrical EngineeringPhotoelectric SensorEngineeringCalibration +13

Use of gas as low-k interlayer dielectric in LSI's: Demonstration of feasibility

M.B. Anand, Masao Yamada, H. Shibata

IEEE Transactions on Electron Devices

Low-k Interlayer DielectricEngineeringWire CapacitanceVacuum DeviceInterconnect (Integrated Circuits) +17

Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package

Yoshiaki Shimooka, M. Inoue, Masamori Endo, +6

EngineeringMechanical EngineeringMicro-electromechanical SystemWafer Scale ProcessingAdvanced Packaging (Semiconductors) +14

Cost-effective air-gap interconnects by all-in-one post-removing process

Norimasa Nakamura, Nobutomo Matsunaga, Takeshi Kaminatsui, +2

Materials Science3D Ic ArchitectureElectrical EngineeringConventional Beol ProcessEngineering +10

High performance half-micron PMOSFETs with 0.1um shallow P<sup>+</sup>N junction utilizing selective silicon growth and rapid thermal annealing

H. Shibata, Y. Suizu, S. Samata, +2

Materials ScienceSemiconductor TechnologyElectrical EngineeringEngineeringNanoelectronics +13

A high power-handling RF MEMS tunable capacitor using quadruple series capacitor structure

Hiroaki Yamazaki, Tamio Ikehashi, Tomohiro Saito, +5

2010 IEEE MTT-S International Microwave Symposium

Low-power ElectronicsElectrical EngineeringEnergy HarvestingMems CapacitorsEngineering +10

A high-speed 64K CMOS RAM with bipolar sense amplifiers

J. Miyamoto, S. Saito, H.S. Momose, +3

IEEE Journal of Solid-State Circuits

Electrical EngineeringChip SizeEngineeringVlsi DesignMixed-signal Integrated Circuit +8

A 25-ns 1-Mbit CMOS SRAM with loading-free bit lines

M. Matsui, T. Ohtani, J. Tsujimoto, +11

IEEE Journal of Solid-State Circuits

Hardware SecurityLow-power ElectronicsElectrical EngineeringChip SizeCell Size +9