Yoshiaki Shimooka

Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL

D. Edelstein, H. Rathore, C. Davis et al. · 2004 · 23 citations

Engineering, Chip-package Reliability Stress, Interconnect (Integrated Circuits) +20

Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package

Yoshiaki Shimooka, M. Inoue, Masamori Endo et al. · 2008 · 21 citations

Engineering, Mechanical Engineering, Micro-electromechanical System +16

Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology

D. Edelstein, C. Davis, L. A. Clevenger et al. · 2004 · 18 citations

Engineering, Vlsi Design, Chip-package Reliability +16

EM lifetime improvement of Cu damascene interconnects by p-SiC cap layer

M. Hatano, T. Usui, Yoshiaki Shimooka et al. · 2003 · 14 citations

Mean Time, Engineering, Interconnect (Integrated Circuits) +18

Correlation of W-Si-N Film Microstructure with Barrier Performance against Cu Diffusion

Yoshiaki Shimooka, Takashi Iijima, Shin Nakamura et al. · Japanese Journal of Applied Physics · 1997 · 13 citations

Engineering, Silicon On Insulator, Semiconductor Nanostructures +17