Statistics
Publications
13
Citations
512
H-Index
11
Active since
1970
B. Agarwala is an author at IBM (United States) specializing in electronic materials, materials science, and materials engineering.
Publications per year
1970–2004
13
13
A high performance liner for copper damascene interconnects
D. Edelstein, Cyprian Uzoh, C. Cabral et al. · 2001 · 92 citations
Engineering, Computer Engineering, Electrical Engineering +17
Scaling effect on electromigration in on-chip Cu wiring
C.‐K. Hu, R. Rosenberg, H. Rathore et al. · 2003 · 66 citations
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