R. G. Filippi

Electromigration threshold in copper interconnects

P.-C. Wang, R. G. Filippi · Applied Physics Letters · 2001 · 118 citations

Advanced Packaging, Materials Science, Electrical Engineering +14

The electromigration short-length effect in Ti-AlCu-Ti metallization with tungsten studs

R. G. Filippi, G. Biery, R. Wachnik · Journal of Applied Physics · 1995 · 72 citations

Engineering, Resistance Saturation Approach, Interconnect (Integrated Circuits) +17

The effect of current density and stripe length on resistance saturation during electromigration testing

R. G. Filippi, R. Wachnik, H. Aochi et al. · Applied Physics Letters · 1996 · 53 citations

Materials Engineering, Electrical Engineering, Resistance Change +15

Via-Depletion Electromigration in Copper Interconnects

C. Christiansen, B. Li, J. Gill et al. · IEEE Transactions on Device and Materials Reliability · 2006 · 26 citations

Engineering, Via-depletion Electromigration, Bimodal Failure Distributions +17

A time-dependent clustering model for non-uniform dielectric breakdown

Ernest Y. Wu, Benzheng Li, J. H. Stathis et al. · 2013 · 25 citations

Engineering, Damage Mechanism, Reliability Engineering +16