Linjun Cao

A 7nm CMOS technology platform for mobile and high performance compute application

B. Jagannathan, Akihisa Ogino, D. Jaeger et al. · 2017 · 58 citations

Engineering, Vlsi Design, Computer Architecture +17

Grain structure analysis and effect on electromigration reliability in nanoscale Cu interconnects

Linjun Cao, K. J. Ganesh, Lijuan Zhang et al. · Applied Physics Letters · 2013 · 44 citations

Engineering, Interconnect (Integrated Circuits), Wafer Scale Processing +21

Effect of metal line width on electromigration of BEOL Cu interconnects

Seungman Choi, C. Christiansen, Linjun Cao et al. · 2018 · 25 citations

Engineering, Interconnect (Integrated Circuits), Metal Line Width +16

New analytical equations for skin and proximity effects in interconnects operated at high frequency

Haojun Zhang, Jian‐Hsing Lee, Natarajan Mahadeva Iyer et al. · 2017 · 17 citations

Operating Frequency, Engineering, New Analytical Equations +20

Co Liner Impact on Microstructure of Cu Interconnects

Xunyuan Zhang, Linjun Cao, Vivian Ryan et al. · ECS Journal of Solid State Science and Technology · 2014 · 16 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16