Daniel Scevola

Statistics

Publications

Citations

465

H-Index

Active since

2005

Affiliations

Commissariat à l'Énergie Atomique et aux Énergies Alternatives(Current)

CEA Grenoble

Laboratoire d'Électronique des Technologies de l'Information

STMicroelectronics (France)

Université Grenoble Alpes

Daniel Scevola is an author at Commissariat à l'Énergie Atomique et aux Énergies Alternatives specializing in engineering, bonding, and three-dimensional integration.

Publications per year

2005–2019

Publications

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

S. Lhostis, A. Farcy, E. Deloffre et al. · 2016 · 92 citations

Engineering, Electrical Engineering, Microelectronics +16

Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness

J. Jourdon, S. Lhostis, S. Moreau et al. · 2018 · 84 citations

Engineering, Electrical Engineering, Microelectromechanical Systems +16

Copper Direct-Bonding Characterization and Its Interests for 3D Integration

Pierric Gueguen, L. Di Cioccio, Patrice Gergaud et al. · Journal of The Electrochemical Society · 2009 · 67 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +15

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

P. Coudrain, P. Chausse, L. Arnaud et al. · 2019 · 65 citations

Engineering, Computer Engineering, Computer Systems +17

Breakthroughs in 3D Sequential technology

Laurent Brunet, C. Fenouillet-Béranger, P. Batude et al. · 2018 · 52 citations

Engineering, Electrical Engineering, Materials Science +13

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