Curry Lin

Redistribution Layers (RDLs) for 2.5D/3D IC Integration

John H. Lau, P. Tzeng, Cheng Lung Lee et al. · Journal of Microelectronics and Electronic Packaging · 2014 · 56 citations

Engineering, Electrical Engineering, Materials Science +17

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, John H. Lau, Ming Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 48 citations

Engineering, Electrical Engineering, Materials Engineering +17

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, Chieh-Lin Chang, Jhih-Yuan Pan et al. · 2018 · 35 citations

Engineering, Electrical Engineering, Materials Engineering +17

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

Cheng-Ta Ko, Henry Yang, John H. Lau et al. · Journal of Microelectronics and Electronic Packaging · 2018 · 30 citations

Engineering, Electrical Engineering, Materials Engineering +17

Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration

John H. Lau, Cheng-Ta Ko, Chia-Yu Peng et al. · Journal of Microelectronics and Electronic Packaging · 2020 · 24 citations · Full text

Engineering, Materials Engineering, Microfabrication +15