Concepedia

Jhih-Yuan Pan

JP

5

Publications

145

Citations

5

H-Index

1996

Active since

Affiliations

Indium Corporation (United States)(Current)

Hong Kong University of Science and Technology

ASM Pacific Technology (China)

Dow Chemical (United States)

Micron Corporation (United States)

Jhih-Yuan Pan is an author at Indium Corporation (United States) specializing in electrical engineering, electronic packaging, and engineering.

Top concepts

EngineeringElectronic PackagingElectrical Engineering3D PrintingMicroelectronicsThree-dimensional Heterogeneous IntegrationHeat TransferMaterial ScienceEnergy EfficiencyAdvanced Packaging

Publications per year

1996–2018

5

Publications

5

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, John H. Lau, Ming Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 47 citations

Engineering, Energy Efficiency, Computer Architecture +16

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, Chieh-Lin Chang, Jhih-Yuan Pan et al. · 2018 · 34 citations

Engineering, Energy Efficiency, Computer Architecture +18

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

Cheng-Ta Ko, Henry Yang, John H. Lau et al. · Journal of Microelectronics and Electronic Packaging · 2018 · 29 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

Fluid Circuit Technology: Integrated Interconnect Technology for Miniature Fluidic Devices

D. VerLee, A. J. Alcock, Gregory A. Clark et al. · 1996 · 19 citations · Full text

PLANARIZATION AND INTEGRATION OF SHALLOW TRENCH ISOLATION

Jhih-Yuan Pan, Dennis O. Ouma, Ping Li et al. · 1998 · 16 citations

Advanced Packaging, Sti Planarization Mask, Electrical Engineering +13

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