Henry Yang

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Dewen Tian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 155 citations

Engineering, Materials Engineering, Materials Science +17

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

John H. Lau, Ming Li, Qingqian Margie Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 93 citations

Engineering, Electrical Engineering, Materials Science +15

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

John H. Lau, Ming Li, Margie Li Qingqian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 85 citations

Engineering, Computer Engineering, Manufacturing Processes +13

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

John H. Lau, Ming Li, Nelson Fan et al. · Journal of Microelectronics and Electronic Packaging · 2017 · 40 citations

Engineering, Materials Engineering, Materials Science +15

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

Cheng-Ta Ko, Henry Yang, John H. Lau et al. · Journal of Microelectronics and Electronic Packaging · 2018 · 30 citations

Engineering, Electrical Engineering, Materials Engineering +17