Concepedia

Chieh-Lin Chang

CC

3

Publications

110

Citations

3

H-Index

2018

Active since

Affiliations

Indium Corporation (United States)(Current)

ASM Pacific Technology (China)

Hong Kong University of Science and Technology

Micron Corporation (United States)

Dow Chemical (United States)

Chieh-Lin Chang is an author at Indium Corporation (United States) specializing in engineering, electronic packaging, and 3d printing.

Top concepts

Publications per year

2018–2018

3

Publications

3

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, John H. Lau, Ming Li et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 47 citations

, , +16

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Cheng-Ta Ko, Chieh-Lin Chang, Jhih-Yuan Pan et al. · 2018 · 34 citations

, , +18

Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration

Cheng-Ta Ko, Henry Yang, John H. Lau et al. · Journal of Microelectronics and Electronic Packaging · 2018 · 29 citations

, , +15

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