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Publications
1
Citations
56
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Active since
2014
Cheng Lung Lee is an author specializing in circuit integration, surface passivation, and back-end-of-line integration.
Publications per year
2014–2014
Redistribution Layers (RDLs) for 2.5D/3D IC Integration
John H. Lau, P. Tzeng, Cheng Lung Lee et al. · Journal of Microelectronics and Electronic Packaging · 2014 · 56 citations
Engineering, Electrical Engineering, Materials Science +17
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