Concepedia

Chia-Yu Peng

CP

4

Publications

97

Citations

4

H-Index

2020

Active since

Affiliations

Nanya Technology (Taiwan)(Current)

Chia-Yu Peng is an author at Nanya Technology (Taiwan) specializing in electrical engineering, electronic packaging, and engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMicroelectronicsMicrofabricationAdvanced PackagingIntegrated CircuitsComputer EngineeringHeterogeneous IntegrationThree-dimensional Heterogeneous Integration

Publications per year

2020–2021

4

Publications

4

Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration

John H. Lau, Cheng-Ta Ko, Kai-Ming Yang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 43 citations

Engineering, Energy Efficiency, Reliability Assessment +21

Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration

John H. Lau, Cheng-Ta Ko, Chia-Yu Peng et al. · Journal of Microelectronics and Electronic Packaging · 2020 · 23 citations · Full text

Engineering, Computer Architecture, Panel-level Packaging +17

Fan-Out Panel-Level Packaging of Mini-LED RGB Display

John H. Lau, Cheng-Ta Ko, Curry Lin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 17 citations

Advanced Packaging, Electrical Engineering, Solid-state Lighting +14

Development of High-Density Hybrid Substrate for Heterogeneous Integration

Chia-Yu Peng, John H. Lau, Cheng-Ta Ko et al. · 2021 · 14 citations

Engineering, Device Integration, High-density Hybrid Substrate +16

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