Thomas Detzel - Concepedia

Author

Thomas Detzel

Infineon Technologies (Austria)ORCID

Also Known As

T Detzel, T. Detzel, Thomas Detzel

Publications

991

Citations

H-Index

Concepts

All Affiliations

Infineon Technologies (Austria)Österreichisches Forschungsinstitut für Chemie und Technik Montanuniversität Leoben Erich Schmid Institute of Materials Science Austrian Academy of Sciences

About

Thomas Detzel is an author at Infineon Technologies (Austria) specializing in applied physics, engineering, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	18	920
2	Applied Physics	15	16	867
3	Electrical Engineering	5	5	246
4	Natural Sciences	1	1	30
5	Chemistry	1	1	30

Thomas Detzel

Publications

939

Citations

H-Index

Page 1

	Year	Citations
A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films Kurt Matoy, Helmut Schönherr, Thomas Detzel, Thin Solid Films EngineeringFlexible ElectronicsMechanical BehaviorMicrofabricationMechanical Engineering	2009	254
Influence of Buffer Carbon Doping on Pulse and AC Behavior of Insulated-Gate Field-Plated Power AlGaN/GaN HEMTs G. Verzellesi, Luca Morassi, Gaudenzio Meneghesso, IEEE Electron Device Letters Wide-bandgap SemiconductorElectrical EngineeringEngineeringNanoelectronicsPulse Behavior	2014	113
Interface fracture properties of thin films studied by using the micro-cantilever deflection technique Kurt Matoy, Thomas Detzel, Matthias Müller, Surface and Coatings Technology Materials ScienceEngineeringMicrofabricationMechanical BehaviorMicro-cantilever Deflection Technique	2009	80
Degradation Mechanisms of GaN HEMTs With p-Type Gate Under Forward Gate Bias Overstress Maria Ruzzarin, Matteo Meneghini, A. Barbato, IEEE Transactions on Electron Devices Semiconductor TechnologyWide-bandgap SemiconductorElectrical EngineeringGan HemtsEngineering	2018	73
Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing Rui Huang, W. Robl, H. Ceric, IEEE Transactions on Device and Materials Reliability EngineeringSevere Plastic DeformationMechanical EngineeringMicrostructure-strength RelationshipElectronic Packaging	2009	63
Growth and melting behaviour of thin in films on Ge(100) Georg Krausch, Thomas Detzel, H. Bielefeldt, Applied Physics A Materials ScienceMaterials EngineeringEngineeringSurface ScienceApplied Physics	1991	42
Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples Alexander Wimmer, Martin Smolka, W. Heinz, Materials Science and Engineering A Materials ScienceElectromigration TechniqueIntragranular PlasticEngineeringSevere Plastic Deformation	2014	40
Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction Alexander Wimmer, W. Heinz, Thomas Detzel, Acta Materialia Materials ScienceEngineeringPhysicsNanotechnologySurface Science	2014	36
Damage evolution during cyclic tension–tension loading of micron-sized Cu lines Alexander Wimmer, Alexander Leitner, Thomas Detzel, Acta Materialia Materials ScienceDamage MechanismEngineeringSevere Plastic DeformationMechanical Engineering	2014	33
Binding and mobility of isolated indium atoms on Si(111)7×7 Georg Krausch, Thomas Detzel, R. Fink, Physical Review Letters EngineeringChemistrySilicon On InsulatorIsolated Indium AtomsRegular Adsorption Sites	1992	30

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