Kiyeong Kim

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring

Jonghyun Cho, Eakhwan Song, Ki-Hyun Yoon et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 166 citations

Engineering, Computer Engineering, Electrical Engineering +17

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Jun So Pak, Joohee Kim, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 128 citations

Engineering, Computer Engineering, Electrical Engineering +17

Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

Jaemin Kim, Woojin Lee, Yujeong Shim et al. · IEEE Transactions on Advanced Packaging · 2010 · 98 citations

Engineering, Computer Engineering, Electrical Engineering +17

Measurement and Analysis of a High-Speed TSV Channel

Heegon Kim, Jonghyun Cho, Myunghoi Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 60 citations

Engineering, Computer Engineering, Electrical Engineering +16

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Kiyeong Kim, Chulsoon Hwang, Kyoungchoul Koo et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 58 citations

Engineering, Computer Engineering, Electrical Engineering +17