Heegon Kim

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 479 citations

Engineering, Vlsi Design, Scalable Model +17

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

D. Jung, Youngwoo Kim, Jonghoon J. Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 67 citations

Materials Engineering, Silicon Via, Electrical Engineering +15

Depth-Based Detection of Standing-Pigs in Moving Noise Environments

Jinseong Kim, Yeonwoo Chung, Younchang Choi et al. · Sensors · 2017 · 66 citations · Full text

Engineering, Surveillance Camera Environment, Video Surveillance +18

Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

Kyungjun Cho, Youngwoo Kim, Hyunsuk Lee et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 62 citations

Engineering, Vlsi Design, Timing Jitter +18

Measurement and Analysis of a High-Speed TSV Channel

Heegon Kim, Jonghyun Cho, Myunghoi Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 60 citations

Channel Modeling, Channel Losses, Electrical Engineering +15