Yujeong Shim

Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method

Jaemin Kim, Woojin Lee, Yujeong Shim et al. · IEEE Transactions on Advanced Packaging · 2010 · 98 citations

Power Engineering, Engineering, Power Optimization (Eda) +20

A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Myunghoi Kim, Kyoungchoul Koo, Chulsoon Hwang et al. · IEEE Transactions on Electromagnetic Compatibility · 2012 · 41 citations

Electrical Engineering, Power/ground Noise Suppression, Ground Structure +14

Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis

Bumhee Bae, Yujeong Shim, Kyoungchoul Koo et al. · IEEE Transactions on Electromagnetic Compatibility · 2013 · 26 citations

Hierarchical Structure, Electrical Engineering, Engineering +12

Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission

Eakhwan Song, Jeonghyeon Cho, Jiseong Kim et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 22 citations

Fourier Transform, Engineering, Mixed-signal Integrated Circuit +13

Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package

Yujeong Shim, Jong‐Bae Park, Jaemin Kim et al. · IEEE Transactions on Electromagnetic Compatibility · 2009 · 21 citations

Electrical Engineering, Physical Design (Electronics), Engineering +14