Kyoungchoul Koo

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Kiyeong Kim, Chulsoon Hwang, Kyoungchoul Koo et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 57 citations

Engineering, Vlsi Design, Computer Architecture +17

Analytical expressions for maximum transferred power in wireless power transfer systems

Sunkyu Kong, Myunghoi Kim, Kyoungchoul Koo et al. · 2011 · 49 citations

Engineering, Radio Frequency, Transferred Power +17

A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Myunghoi Kim, Kyoungchoul Koo, Chulsoon Hwang et al. · IEEE Transactions on Electromagnetic Compatibility · 2012 · 41 citations

Electrical Engineering, Power/ground Noise Suppression, Ground Structure +14

Fast Algorithm for Minimizing the Number of decap in Power Distribution Networks

Kyoungchoul Koo, Gerardo Romo Luevano, Tao Wang et al. · IEEE Transactions on Electromagnetic Compatibility · 2017 · 29 citations

Power Engineering, Engineering, Pcb Designs +16

Sparse Emission Source Microscopy for Rapid Emission Source Imaging

Ling Zhang, Victor Khilkevich, Xiangyang Jiao et al. · IEEE Transactions on Electromagnetic Compatibility · 2017 · 27 citations

Image Reconstruction, Engineering, Microscopy +17