Boyd Rogers

Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test

Tong Yan Tee, B Long, Rex Anderson et al. · 2008 · 36 citations

Engineering, Electrical Engineering, Microelectronics +15

Adaptive Patterning Design Methodologies

Craig Bishop, Boyd Rogers, Chris Scanlan et al. · 2016 · 36 citations

Engineering, Manufacturing Engineering, Microfabrication +15

Improving WLCSP Reliability Through Solder Joint Geometry Optimization

Boyd Rogers, Chris Scanlan · IMAPSource Proceedings · 2013 · 24 citations

Engineering, Materials Science, Packaging Design +16

Design for board trace reliability of WLCSP under drop test

Tong Yan Tee, Hun Shen Ng, Ahmer Syed et al. · 2009 · 20 citations

Engineering, Materials Engineering, Materials Science +17

Advanced analysis on board trace reliability of WLCSP under drop impact

Ahmer Syed, Tong Yan Tee, Hun Shen Ng et al. · Microelectronics Reliability · 2010 · 19 citations

Engineering, Systems Engineering, Condition Assessment +7