Concepedia

Rex Anderson

RA

4

Publications

102

Citations

4

H-Index

1997

Active since

Affiliations

Amkor Technology (United States)(Current)

Rex Anderson is an author at Amkor Technology (United States) specializing in engineering, reliability engineering, and mechanics of materials.

Top concepts

EngineeringReliabilityMechanical EngineeringMechanics Of MaterialsReliability EngineeringFailure AnalysisSystems EngineeringComputer EngineeringElectronic PackagingElectrical Engineering

Publications per year

1997–2010

4

Publications

4

Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test

Tong Yan Tee, B Long, Rex Anderson et al. · 2008 · 35 citations

Engineering, Pcb Designs, Mechanical Engineering +18

Rheological characterization of solder pastes for surface mount applications

V. Kolli, Francis Gadala‐Maria, Rex Anderson · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1997 · 28 citations

Materials Science, Rheological Measurement, Engineering +14

Design for board trace reliability of WLCSP under drop test

Tong Yan Tee, Hun Shen Ng, Ahmer Syed et al. · 2009 · 20 citations

Reliability, Electrical Engineering, Reliability Engineering +14

Advanced analysis on board trace reliability of WLCSP under drop impact

Ahmer Syed, Tong Yan Tee, Hun Shen Ng et al. · Microelectronics Reliability · 2010 · 19 citations

Reliability, Reliability Engineering, Engineering +8

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